This material is based upon work supported by the National Science Foundation under Grant No. 1711447.
Disclaimer:
Any opnions, findings, and conclusions or recommendations expressed in this material are those of the author(s) and do not necessarily reflect the views of the National Science Foundation.
Adaptive Thermal Management for Next-Generation Implantable Devices
Publications:
- A. Ermis, M. Zhou, Y.-P. Lai, and Y. Zhang, “A Performance Comparison of LSTM and Recursive SID Methods in Thermal Modeling of Implantable Medical Devices,” accepted by the 2020 IEEE Conference on Control Technology and Applications (CCTA), Montréal, Canada, August 24-26, 2020.
- A. Ermis, Y.-P. Lai, X. Pan, R. Chai, and Y. Zhang, “Recursive Subspace Identification for Online Thermal Management of Implantable Devices,” in Proc. of the 2019 57th Annual Allerton Conference on Communication, Control, and Computing (Allerton), Monticello, Illinois, USA, September 24-27, 2019.
- R. Chai and Y. Zhang, “Adaptive Thermal Management of Implantable Device,” IEEE Sensors Journal, vol. 19, no. 3, pp. 1176-1185, February 2019.
- R. Chai, Y.-P. Lai, W. Sun, M. Ghovanloo, and Y. Zhang, “Online Predictive Modeling for the Thermal Effect of Implantable Devices,” in Proc. of the 2018 IEEE Biomedical Circuits and Systems Conference (BioCAS 2018), Cleveland, Ohio, USA, October 17-19, 2018.
- R. Chai, Y. Zhang, and M. Ghovanloo, “Joint Power and Thermal Management for Implantable Devices,” Biomedical Circuits and Systems Conference (BioCAS 2015), pp. 65-68, Atlanta, GA, 2015.